[New] Huawei has said it expects to design competitive chips by 2031, and SMIC is reportedly producing 7-nanometer parts for Huawei's current Ascend AI accelerators.
Tech Startups - Tech News, Tech Trends & Startup Fundin
Huawei says it will use its new approach to produce components with performance equivalent to a 1.4-nanometer chipmaking process by 2031.
Wired
Open Radio Access Networks is a technology that holds the potential to bring further competition to areas where Huawei and ZTE have been traditionally dominant.
Roza.Pace@trade.gov
By focusing on RF modules, Huawei offers a chance to consider what areas require its attention to build the essential technologies, designs, and intellectual property (IP), which may be expected to generate to design of a whole integrated module system in China.
Precedence Research
Failing to export American AI while China ramps up capacity to eventually serve third markets risks repeating the mistake of 5G, where the United States pioneered the underlying technology but ceded global deployment to Huawei.
CNAS
DeepSeek V4 - Pro runs on Huawei Ascend 950 clusters launching in H2 2026, at which point pricing is expected to drop further.
AI to ROI - By Ray Rike and Peter Buchanan
DeepSeek's prices could get even cheaper: It expects to lower V4 - Pro prices later in the year as Huawei scales up production of its new Ascend 950 AI processors.
Fortune
At least two non-Chinese countries will sign major Huawei AI infrastructure deals by mid-2027.
Tech Insider
With new arrivals expected from Apple, Google, Huawei, Garmin and more, 2026 looks set to be a massive year for wearables.
OzMobiles
Filings from Zhejiang University, Huawei, and Qualcomm collectively signal that the integration of sensing and 5G NR V2X communication in a single mmWave waveform will become a core standards dispute in the 2026-2030 window.
PatSnap
Last updated: 21 June 2026
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